首页> 外文OA文献 >Capability of Single-Sided Transient Thermographic Imaging Method for Detection of Flat Bottom Hole Defects in High-Temperature Composite Materials
【2h】

Capability of Single-Sided Transient Thermographic Imaging Method for Detection of Flat Bottom Hole Defects in High-Temperature Composite Materials

机译:单面瞬态热成像成像方法检测高温复合材料平底孔缺陷的能力

代理获取
本网站仅为用户提供外文OA文献查询和代理获取服务,本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文,但由于OA文献来源多样且变更频繁,仍可能出现获取不到、文献不完整或与标题不符等情况,如果获取不到我们将提供退款服务。请知悉。

摘要

A portion of the development effort for high temperature composite materials is dedicated to the assessment of nondestructive evaluation (NDE) technologies for detecting flaws in these materials [1,2]. To illustrate the importance of defect detection and characterization, figure l(a) shows the results of a delamination sensitivity analysis on a CMC material in consideration for use as a hot section material in advanced aircraft engines. The study indicates that as the size of delaminations increases from 3×3 mm to 25×25 mm, the hot surface temperature increases up to 50 percent making the material unusable for hot section application. Recent technological advancements in infrared camera technology and computer power have made thermographic imaging systems worth evaluating as a nondestructive evaluation tool for advanced composites. Thermography offers the advantages of real-time inspection, no contact with sample, non-ionizing radiation, complex-shape inspection capability, variable field of view size, and portability. The objective of this study was to evaluate the ability of a thermographic imaging technique for detecting flat-bottom hole defects of various diameters and depths in 4 composite systems of interest as high-temperature structural materials. The technique used in this study utilized high intensity flash lamps to heat the sample located on the same side of the detecting infrared camera. The composite systems were (fiber/matrix): silicon carbide/calcia-alumina-silica (SiC/ CAS) CMC, silicon carbide/silicon carbide (SiC/SiC) CMC, silicon carbide/titanium alloy (SiC/Ti) MMC, and graphite/polyimide PMC. The holes ranged from 1 to 13 mm in diameter and 0.1 to 2.5 mm in depth in samples approximately 2 to 3 mm thick. Ultrasonic and radiographie images of the samples were obtained and compared with the thermographic images.
机译:高温复合材料开发工作的一部分致力于评估无损评估(NDE)技术,以检测这些材料中的缺陷[1,2]。为了说明缺陷检测和表征的重要性,图l(a)显示了考虑用作先进飞机发动机中热段材料的CMC材料的分层敏感性分析结果。研究表明,当分层的大小从3×3 mm增加到25×25 mm时,热表面温度增加高达50%,使该材料无法用于热段应用。红外相机技术和计算机技术的最新技术进步使热成像成像系统值得作为先进复合材料的无损评估工具进行评估。热成像技术具有以下优点:实时检查,不与样品接触,非电离辐射,复杂形状的检查能力,可变的视场大小和便携性。这项研究的目的是评估热成像技术检测4种作为高温结构材料的复合系统中各种直径和深度的平底孔缺陷的能力。本研究中使用的技术利用高强度闪光灯来加热位于检测红外摄像机同一侧的样品。复合系统是(纤维/基质):碳化硅/氧化钙-氧化铝-二氧化硅(SiC / CAS)CMC,碳化硅/碳化硅(SiC / SiC)CMC,碳化硅/钛合金(SiC / Ti)MMC和石墨/聚酰亚胺PMC。在大约2至3毫米厚的样品中,孔的直径范围为1至13毫米,深度为0.1至2.5毫米。获得了样品的超声和射线照相图像,并将其与热成像图像进行比较。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
代理获取

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号